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Mfr
ITT Cannon, LLC
Cinch Connectivity Solutions
HARTING
EDAC Inc.
SparkFun Electronics
Advantech Corp
TE Connectivity AMP Connectors
3M
Pi Supply
Adam Tech
Kycon, Inc.
Molex
Panasonic Electric Works
Hirose Electric Co Ltd
CW Industries
Sullins Connector Solutions
Dialight
KYOCERA AVX
ATTEND Technology
Vishay Dale
Pulse Electronics
TE Connectivity
Digi
Amphenol ICC (FCI)
Samtec Inc.
Amphenol ICC (Commercial Products)
JAE Electronics
Red Lion Controls
TE Connectivity Aerospace, Defense and Marine
Series
*
392
AMP Pace
MT-Edge
408
Amp-Edge
325
Linear
SM3
306
307
Next Generation PACE
746
Mini-Edge
AXC
MM60
MM70
379
PCI Express® (PCIe)
Mini Crown Edge, Elcon
MEC6 - DV
MEC6 - RA
MEC8 - RA
MEC8 - DV
6411
737
AMP EDGE Type II
C7 - DS
Power
717
Package
Tape & Reel (TR)
Tray
Cut Tape (CT)
Strip
Bulk
Tape & Box (TB)
Tube
Box
Bag
-
Retail Package
Base Product Number
000907
045714
045719
045844
045845
045911
045912
046720
075594
075791
075800
076291
076693
151187
170305
171774
ASC30
ASC31
FMB10
FMB20
FMB22
FMB55
FMB85
GMA22
GMA24
GMA28
GMA36
GMC22
GMC24
GMC26
Contact Material
-
Beryllium Copper
Beryllium Nickel
Brass
Copper
Copper Alloy
Copper, Nickel, Tin Alloy
Phosphor Bronze
Phosphor Bronze - Tin Plated
Phosphor Bronze Alloy
Spinodal
Number of Positions/Bay/Row
-
16
17
18
18; 31
19
2
20
21
21; 41
22
23
24
25
26
27
28
28; 14
28; 14; 28
28; 14; 28; 14
28; 14; 28; 2
28; 28; 28; 28; 28
29
3
3; 8
30
31
31; 18
32
33
Product Status
Active
Obsolete
Discontinued at Digi-Key
Last Time Buy
Not For New Designs
Number of Rows
1
2
Operating Temperature
-
-20°C ~ 105°C
-20°C ~ 80°C
-20°C ~ 85°C
-30°C ~ 85°C
-40°C ~ 100°C
-40°C ~ 105°C
-40°C ~ 125°C
-40°C ~ 80°C
-40°C ~ 85°C
-40°C ~ 90°C
-40°C ~ 95°C
-55°C ~ 105°C
-55°C ~ 125°C
-55°C ~ 85°C
-65°C ~ 105°C
-65°C ~ 125°C
-65°C ~ 150°C
-65°C ~ 200°C
-65°C ~ 250°C
-65°C ~ 85°C
0°C ~ 85°C
-10°C ~ 85°C
Termination Rows
1
2
Gender
-
Female
Male
Contact Finish
-
Gold
Gold or Gold-Palladium
Gold-Palladium
Tin
Tin-Lead
Color
-
Black
Blue
Brown
Gray
Green
Ivory
Natural
Orange
Red
White
Yellow
Read Out
-
Dual
Single
Features
-
Bi-Level - High Density
Bi-Level - High Density, Board Lock
Bi-Level - High Density, Card Extender
Board Guide
Board Guide, Board Lock
Board Guide, Board Lock, Card Extender
Board Guide, Board Lock, Latches
Board Guide, Board Lock, Solder Retention
Board Guide, Card Extender
Board Guide, Card Extender, Clips, Locking Ramp
Board Guide, Card Extender, Locking Ramp
Board Guide, Card Guide
Board Guide, Card Latch
Board Guide, Guide Pin
Board Guide, Keyed
Board Guide, Latches
Board Guide, Locking Ramp
Board Guide, Mating Guide
Board Guide, Organizer, Rails
Board Guide, Pick and Place
Board Guide, Pick and Place Cap, Solder Retention
Board Guide, Pick and Place, Solder Retention
Board Guide, Solder Retention
Board Lock
Board Lock, Card Extender
Board Lock, Guide Pin
Board Lock, Latches
Board Lock, Locking Ramp
Board Lock, Pick and Place
Contact Type
-
Cantilever
Full Bellows
Full Bellows with Back-Up Spring
Hairpin Bellows
Hairpin Bellows, Make Before Break
Loop Bellows
Semi Bellows
Cantilever, Make Before Break
Card Type
-
Advanced Mezzanine Card B+, MicroTCA
AGP
AGP Pro Universal
AGP, Universal
CPU - Slot 1
Fits Female Edgecards
ISA
M.2 (NGFF) Mini Card
MCA
MicroTCA™
Multibus I
MXM 3.0
NLX
Non Specified - Dual Edge
Non Specified - Dual Edge, Bi-Level
Non Specified - Single Edge
PCI
PCI 3.3V 32 Bit (PCI-X)
PCI 3.3V 64 Bit
PCI 3.3V, 5V 32 Bit (Universal)
PCI 3.3V, 5V 64 Bit
PCI 5V 32 Bit
PCI 5V 64 Bit
PCI Express Mini Card
PCI Express™
PCI™
PCMCIA - ExpressCard™
Special 18/31 Dual Combo
VRM
Card Thickness
-
0.125" (3.18mm)
0.086" ~ 0.101" (2.18mm ~ 2.56mm)
0.031" (0.79mm)
0.032" ~ 0.070" (0.81mm ~ 1.78mm)
0.039" (1.00mm)
0.047" (1.20mm)
0.050" (1.27mm)
0.051" ~ 0.067" (1.30mm ~ 1.70mm)
0.054" ~ 0.070" (1.37mm ~ 1.78mm)
0.054" ~ 0.071" (1.37mm ~ 1.80mm)
0.054" ~ 0.072" (1.37mm ~ 1.82mm)
0.055" (1.40mm)
0.055" ~ 0.070" (1.40mm ~ 1.78mm)
0.057" ~ 0.072" (1.45mm ~ 1.82mm)
0.059" (1.50mm)
0.062" (1.57mm)
0.063" (1.60mm)
0.063" ~ 0.093" (1.60mm ~ 2.36mm)
0.064" (1.63mm)
0.065" (1.66mm)
0.071" (1.80mm)
0.076" (1.93mm)
0.093" (2.36mm)
0.094" (2.39mm)
Flange Feature
-
Flush Mount, Floating Bobbin, 0.116" (2.95mm) Dia
Flush Mount, Side Opening, Unthreaded, 0.125" (3.18mm) Dia
Flush Mount, Side Opening, Unthreaded, 0.128" (3.25mm) Dia
Flush Mount, Side Opening, Unthreaded, 0.145" (3.68mm) Dia
Flush Mount, Top Opening, Threaded Insert, 4-40
Flush Mount, Top Opening, Unthreaded, 0.125" (3.18mm) Dia
Flush Mount, Top Opening, Unthreaded, 0.126" (3.20mm) Dia
Flush Mount, Top Opening, Unthreaded, 0.128" (3.25mm) Dia
Flush Mount, Top Opening, Unthreaded, 0.130" (3.30mm) Dia
Flush Mount, Top Opening, Unthreaded, 0.156" (3.96mm) Dia
Side Mount Opening, Staggered Ears, Unthreaded, 0.125" (3.18mm) Dia
Side Mount Opening, Threaded Insert, 4-40
Side Mount Opening, Unthreaded, 0.125" (3.18mm) Dia
Side Mount Opening, Unthreaded, 0.128" (3.25mm) Dia
Side Mount Opening, Unthreaded, 0.145" (3.68mm) Dia
Straddle Mount Opening, Unthreaded, 0.075" (1.90mm)
Straddle Mount Opening, Unthreaded, 0.078" (1.98mm)
Straddle Mount Opening, Unthreaded, 0.087" (2.20mm)
Straddle Mount Opening, Unthreaded, 0.094" (2.40mm)
Top Mount Opening, Floating Bobbin, 0.116" (2.95mm) Dia
Top Mount Opening, Threaded Insert, 4-40
Top Mount Opening, Unthreaded, 0.125" (3.18mm) Dia
Top Mount Opening, Unthreaded, 0.126" (3.20mm) Dia
Top Mount Opening, Unthreaded, 0.128" (3.25mm) Dia
Top Mount Opening, Unthreaded, 0.130" (3.30mm) Dia
Top Mount Opening, Unthreaded, 0.142" (3.61mm) Dia
Top Mount Opening, Unthreaded, 0.156" (3.96mm) Dia
Top Mount Opening, Threaded Insert, M3
Flush Mount, Top Opening, Threaded Insert, M3
Termination
-
Crimp
IDC
Kinked Pin, Solder
Press-Fit
Press-Fit, Wire Wrap
Solder
Solder Eyelet(s)
Solder, Staggered
Solder, Wire Wrap
Wire Wrap
Mounting Type
-
Board Edge, Straddle Mount
Board Edge, Through Hole
Free Hanging (In-Line)
Panel Mount
Panel Mount, Through Hole
Surface Mount
Surface Mount, Right Angle
Surface Mount, Through Hole
Through Hole
Through Hole, Right Angle
Wire Wrap
Contact Finish Thickness
-
16.0µin (0.41µm)
2.00µin (0.051µm)
29.5µin (0.75µm)
3.00µin (0.076µm)
3.94µin (0.10µm)
30.0µin (0.76µm)
5.00µin (0.127µm)
5.11µin (0.130µm)
50.0µin (1.27µm)
8.00µin (0.203µm)
80.0µin (2.03µm)
Flash
1.00µin (0.025µm)
10.0µin (0.25µm)
100.0µin (2.54µm)
11.8µin (0.30µm)
118.1µin (3.00µm)
15.0µin (0.38µm)
Material - Insulation
-
Diallyl Phthalate (DAP)
Diallyl Phthalate (DAP), Glass Filled
Liquid Crystal Polymer (LCP)
Liquid Crystal Polymer (LCP), Glass Filled
Nylon
Nylon, Glass Filled
Phenol Formaldehyde (Phenolic)
Phenol Formaldehyde (Phenolic), Glass Filled
Plastic
Polyamide (PA), Nylon
Polyamide (PA), Nylon, Glass Filled
Polyamide (PA46), Nylon 4/6
Polyamide (PA46), Nylon 4/6, Glass Filled
Polyamide (PA66), Nylon 6/6
Polyamide (PA66), Nylon 6/6, Glass Filled
Polyamide (PA9T), Nylon 9T
Polyamide (PA9T), Polyphenylene Sulfide (PPS)
Polybutylene Terephthalate (PBT)
Polybutylene Terephthalate (PBT), Glass Filled
Polycarbonate (PC), Glass Filled
Polycyclohexylenedimethylene Terephthalate (PCT)
Polyester
Polyester Thermoplastic
Polyester Thermoplastic, Glass Filled
Polyester, Glass Filled
Polyetheretherketone (PEEK)
Polyphenylene Sulfide (PPS)
Polyphthalamide (PPA)
Thermoplastic
Number of Positions
-
152
154
156
158
16
16 (8 + 8 Power)
16 (Power)
160
160 (130 Loaded)
162
164
166
168
17
17 (Power)
170
172
174
176
178
18
18 (12 + 6 Power)
18 (16 + 2 Power)
18 (Power)
180
182
184
186
188
Pitch
-
0.125" (3.18mm)
0.150" (3.81mm)
0.156" (3.96mm)
0.197" (5.00mm)
0.200" (5.08mm)
0.236" (6.00mm)
0.312" (7.92mm)
0.508" (12.90mm)
0.020" (0.50mm)
0.024" (0.60mm)
0.025" (0.64mm)
0.026" (0.65mm)
0.029" (0.75mm)
0.031" (0.80mm)
0.039" (1.00mm)
0.050" (1.27mm)
0.059" (1.50mm)
0.062" (1.57mm)
0.079" (2.00mm)
0.098" (2.50mm)
0.100" (2.54mm)
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Uncategorized
Wire & Cable Management
Edgeboard Connectors
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